[1-6] 7-12 13-18 19-24 25-30 31-32
Hybrid die-attach represents a convergence of advanced SMT and IC technologies. Equipment serving this market must be extremely flexible to bond many different components while applying two or more different epoxies, in a single pass. It must process the smallest to the largest, and also ultra-thin, die. Various single-pass component presentation methods are required and the equipment must work with many different substrate types. Key bond process parameters such as placement accuracy, bond-line thickness, die tilt, epoxy coverage and fillet, must be met.
Aadvanced Flip Chip Bonder by flip-chip-bonder.net
Founded in 1986, Datacon has become a leading partner and solution supplier in the semiconductor industry. We set trends in advanced packaging worldwide. A vital aspect of our corporate philosophy is to provide the best customer support. We place great value on continuously broadening our customer support department, which inturn has enables us to provide customers with specialists at the right time and place.
Advanced Die Attach Solution by die-attach.net
MCM-die-bonder.com is a global leading supplier of production equipment for the back-end market, called die bonders, for the processing of the individual chips required by manufacturers of semiconductors. Datacon also develops and produces production equipment.
Advanced MCM Die Bonder by mcm-die-bonder.com
Most Affordable Widest Coverage of any Spikes Easy to Install and Maintain UV Protected / Sun and Weather Proof; Not affected by Extreme Temperature (-210 deg F to 310 deg F) The #1 Bird Dropping Control Spike Specified by Architects and Government Agencies! Recommended by all Major Animal Rights Groups as "Safe and Effective" Some of our Product Users - *Building Contractors *Building Management *Property Management *Landscape Contractors *Industrial Warehouses *Building Maintenance *Hotels and Motels.
Bird Spike Strips by bird-spikes.net
With its latest Multi-Chip Die Bonding, the 2200 apm+, Datacon meets the newest challenges of many users. The industry proven platform concept and the superior flexibility of the 2200 apm are now available on the 2200 apm+, with the added capability of handling wafers up to 300 mm and die up to 50 mm. The 2200 apm Multi Chip Die Bonding is the current industry standard based on Datacon's previous PPS 2200 Multi Chip Die Bonding platform, a revolutionary modular system introduced in 1995.The Datacon 2200 apm provides users with extraordinary flexibility with minimum space requirements.
Buy Flip-Chip-Bonder by die-bonding.net
Cable reels are used for storage, unwinding, and winding of conductive cable or lifting cable. Electric cable reels have contacts for maintaining live power during winding. Reels are devices around which lengthy, continuous items such as cable, wires, paper, etc., are wrapped for transportation or storage. Reels are available as simple storage devices although more advanced styles are self-winding.
Buy Wooden Pallets
